Technology 生產技術

NO.OF LAYER 層數                            1-20 layer

Main Base Material 主要板材             FR1,FR2,FR4,CEM1,CEM3,High Frequency Laminate with various dielectric constant(imported or from local supplier), 

                                                        Aluminum base laminate,metal core Aluminum
                                                       FR-1，FR-2，FR-4，CEM-1，CEM-3，各種介電常數的高頻板，鋁基板， 金屬鋁基板

Board Thickness 板厚                     Inner core thickness 0.15-1.5mm,finish board thickness 0.2-3.0mm

                                                        內層板厚0.15-1.5mm，成品板厚:0.2-3.0mm

Copper Foil Thickness                   1/3OZ-6OZ

         銅箔厚度

Process Size 可制作尺寸                  2-1200MM

Min Line Width/Line Space            0.076/0.076 mm,3mil/3mil

最小線寬線距 

Min Drilling Diameter                    0.2mm/8mil

最小鉆孔直徑

Min  Punch Diameter                      0.8mm

最小沖孔直徑

Tolerance公差

Drilling Position 鉆孔位置               ±0.05 mm

Line Width 線寬                               ±10%

Diameter 直徑                                 ±0.076mm

Outline Tolerance                           ±0.05mm（Routing 鑼邊）±0.13mm（Punching 沖板）

成型外形公差     

Size Tolerance                                ±0.1mm

Warpage板翹                                  ≤0.70%

Surface Finish  表面處理工藝           Hot air Leveling(HAL),Electroless Ni/Immersion Au,OSP，Coating，Hard gold plating,Immersion Tin  
                                                       噴錫，化學鍍鎳/沉金，鍍金，抗氧化，鍍硬金，沉錫，松香

V-CUT Size V割尺寸                        Computer V-CUT 1200*600mm,  Manual V-CUT 300*300 mm

Board Thickness板厚                     Computer V-CUT 3.0 mm,  Manual V-CUT 1.6mm

Tolerance公差                               ±0.10mm

Drilled Slot Width鉆槽寬度            0.60mm

 Angle角度                                     30°，45°，90°

Drilled Slot Tolerance鉆槽公差     ±0.076 mm

Roundness Deviation 圓度偏差         ±0.05 mm

Multilayer registration of layer to layer 多層板壓合  

Layer to layer Alignment Tolerance       ±0.05 mm

層與層的對齊公差

Tolerance of board thickness                ±10% 

板厚公差

Impedance 阻抗                                    % ±10